डेटा पत्रक ( Datasheet PDF ) |
भाग संख्या | विवरण | मैन्युफैक्चरर्स | |
DIP24 | Thermal Data ®
Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm |
STMicroelectronics |
|
DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
|
DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
|
DIP24-1Bxx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
|
DIP24-2Axx-xx | (DIP Series) Molded DIP Reed Relays www.DataSheet4U.com
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible w |
MEDER |
www.DataSheet.in | 2017 | संपर्क |