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IDTF0480NBGI डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Matched Broadband RF VGA - Integrated Device Technology

भाग संख्या IDTF0480NBGI
समारोह Matched Broadband RF VGA
मैन्युफैक्चरर्स Integrated Device Technology 
लोगो Integrated Device Technology लोगो 
पूर्व दर्शन
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IDTF0480NBGI pdf
Matched Broadband RF VGA
ABSOLUTE MAXIMUM RATINGS
IDTF0480NBGI
Datasheet
400MHz to 2700MHz
Parameter
VCC to GND
SPI DATA, SPI CSb, SPI CLK, LogicCTL
STBY, Band_Select
R_Bias1
R_Bias2
RFIN externally applied DC voltage
RFOUT externally applied DC voltage
RF Input Power (RFIN) applied for 24
hours maximum
Continuous Power Dissipation
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
ElectroStatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
ElectroStatic Discharge – CDM
(JEDEC 22-C101F)
Symbol
VCC
VdiD
VCntl
IR1
IR1
VRFin
VRFout
Pin
Pdiss
Tj
Tst
Min
-0.3
-0.3
-0.3
+1.4
Vcc - 0.15
-65
Max
+5.5
+3.6
Vcc + 0.25
+1.5
+0.8
+3.6
Vcc + 0.15
+22
1.5
150
150
260
Class 2
(2000 V)
Class C2
(500 V)
Units
V
V
V
mA
mA
V
V
dBm
W
°C
°C
°C
Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at
these or any other conditions above those indicated in the operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL AND MOISTURE CHARACTERISTICS
θJA (Junction – Ambient)
θJC (Junction – Case) The Case is defined as the exposed paddle
Moisture Sensitivity Rating (Per J-STD-020)
40 °C/W
4 °C/W
MSL1
Glitch-FreeTM, Zero-DistortionTM, RF VGA
2
Rev 3, April 2015

विन्यास 27 पेज
डाउनलोड[ IDTF0480NBGI Datasheet.PDF ]


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अनुशंसा डेटापत्रक

भाग संख्याविवरणविनिर्माण
IDTF0480NBGIMatched Broadband RF VGAIntegrated Device Technology
Integrated Device Technology


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