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HFBR-5302 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style - Agilent(Hewlett-Packard)

भाग संख्या HFBR-5302
समारोह Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style
मैन्युफैक्चरर्स Agilent(Hewlett-Packard) 
लोगो Agilent(Hewlett-Packard) लोगो 
पूर्व दर्शन
1 Page
		
<?=HFBR-5302?> डेटा पत्रक पीडीएफ

HFBR-5302 pdf
ELECTRICAL SUBASSEMBLY
DATA OUT
DUPLEX SC
RECEPTACLE
PIN
SIGNAL
DETECT
OUT
QUANTIZER IC
PREAMP IC OPTICAL
SUBASSEMBLIES
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board to which the
IC chips and various surface-
mount passive circuit elements
are attached.
DATA IN
DRIVER IC
LED
Figure 1. Block Diagram.
TOP VIEW
The package outline drawing and
pin out are shown in Figures 2
and 3. The details of this package
outline and pin out are compliant
with the multisource definition of
the 1x9 single in-line package
(SIP). The low profile of the
Hewlett-Packard transceiver
design complies with the
maximum height allowed for the
duplex SC connector over the
entire length of the package.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
(319.5.1420)MAX.
12.70
(0.500)
(215.0.4000)MAX.
HHFBR-5XXX
DATE CODE (YYWW)
SINGAPORE
3.30 ± 0.38
(0.130 ± 0.015)
0.75
+
-
0.08
0.05
(0.030+- 00..000032)
(100.4.3057)MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
2.92
(0.115)
ø (00..04168)(9x)
NOTE 1
18.52
(0.729)
4.14
(0.163)
1.27
+
-
0.25
0.05
(0.050+-
0.010
0.002
)
NOTE 1
23.55
(0.927)
(200.8.3020)[8x(2.54/.100)]
16.70
(0.657)
17.32 20.32 23.32
(0.682) (0.800) (0.918)
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. Package Outline Drawing.
The package includes internal
shields for the electrical and
optical subassemblies to insure
high immunity to external EMI
fields and low EMI emissions.
The outer housing, including the
duplex SC connector, is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts are isolated from the circuit
design of the transceiver, while
they can be connected to a
ground plane on the circuit
board, doing so will have no
impact on circuit performance.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the trans-
ceiver by mating with the duplex
SC connectored fiber cables.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your local
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
216

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अनुशंसा डेटापत्रक

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HFBR-5301Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package StyleAgilent(Hewlett-Packard)
Agilent(Hewlett-Packard)
HFBR-5302Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package StyleAgilent(Hewlett-Packard)
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