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MAX9820 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - DirectDrive Headphone Amplifier - Maxim Integrated Products

भाग संख्या MAX9820
समारोह DirectDrive Headphone Amplifier
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX9820?> डेटा पत्रक पीडीएफ

MAX9820 pdf
DirectDrive Headphone Amplifier
with External Gain
www.DataSheet4U.com
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
C1P to GND................................................-0.3V to (VDD + 0.3V)
C1N to GND ................................................(VSS - 0.3V) to +0.3V
VSS to GND...............................................................-6V to +0.3V
OUTR, OUTL to GND.............................................................±3V
SHDN to GND...........................................................-0.3V to +6V
INR, INL to GND .........................................-0.3V to (VDD + 0.3V)
OUTR, OUTL Short Circuit to GND, VDD....................Continuous
Short Circuit Between OUTL and OUTR ....................Continuous
Continuous Input Current (Into All Other Pins) .................±20mA
Continuous Power Dissipation (TA = +70°C)
10-Pin TDFN Single-Layer PCB (derate 18.5mW/°C
above +70°C)........................................................1481.5mW
Junction-to-Case Thermal Resistance (θJC) (Note 1)
10-Pin TDFN ................................................................8.5°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
10-Pin TDFN ...............................................................41.0°C/W
Continuous Power Dissipation (TA = +70°C)
10-Pin TDFN Multilayer PCB (derate 24.4mW/°C
above +70°C)...........................................................1951mW
Junction-to-Case Thermal Resistance (θJC) (Note 1)
10-Pin TDFN .................................................................9.0°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
10-Pin TDFN ...............................................................41.0°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = VSHDN = 5V, VGND = 0V, RIN = RFB = 40.2k(gain = -1V/V), C1 = C2 = 1µF, C3 = 10µF, RLOAD = , TA = -40°C to +85°C,
unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
GENERAL
Supply Voltage Range
Undervoltage Lockout
Quiescent Current
Shutdown Current
Output Signal Attenuation in
Shutdown
SYMBOL
CONDITIONS
VDD
UVLO
IDD
ISHDN
Guaranteed by PSRR test
VDD = 3.3V
VDD = 5V
VSHDN = 0V, TA = +25°C
VSHDN = 0V, VIN = 1VRMS, RLOAD = 10k
MIN TYP MAX UNITS
2.7 5.5
2.2
3.0 4.6
4.0 6.0
< 0.1
1
V
V
mA
µA
-110
dBV
Output Impedance in
Shutdown
Turn-On Time
Output Offset Voltage
VSHDN = 0V
tON
VOS TA = +25°C (Note 3)
0.6
0.56
±0.1
±0.5
k
ms
mV
Click-and-Pop Level
ZLOAD = 32+ 1µH, peak
Into shutdown
voltage, A-weighted, 32 samples
per second (Notes 3, 4)
Out of
KCP shutdown
ZLOAD = 10k, peak voltage,
Into shutdown
A-weighted, 32 samples per
second (Notes 3, 4)
Out of
shutdown
-79
-77
-62
-58
dBV
2 _______________________________________________________________________________________

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