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APW7137 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Step-Up Converter - Anpec Electronics Coropration

भाग संख्या APW7137
समारोह Step-Up Converter
मैन्युफैक्चरर्स Anpec Electronics Coropration 
लोगो Anpec Electronics Coropration लोगो 
पूर्व दर्शन
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<?=APW7137?> डेटा पत्रक पीडीएफ

APW7137 pdf
APW7137
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Ordering and Marking Information
APW7137
APW7137 B :
W37X
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN Pin to GND
-0.3 to 7
V
VLX LX Pin to GND
-0.3 to 36
V
VEN EN Pin to GND
-0.3 to VIN
V
TJ Maximum Junction Temperature
150 °C
TSTG
Storage Temperature Range
-65 to 150
°C
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260 °C
Note 1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Junction to Ambient Thermal Resistance (Note 2)
θJA
SOT-23-5
260
°C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of package is soldered directly on the PCB.
Recommended Operating Conditions (Note 3)
Symbol
Parameter
VIN VIN Input Voltage
VLX LX to GND Voltage
VOUT
Converter Output Voltage
CIN Input Capacitor
COUT
TA
Output Capacitor
Ambient Temperature
TJ Junction Temperature
Note 3: Refer to the application circuit for further information
Range
2.5 ~ 6
-0.3 ~ 32
VIN ~ 30
2.2 ~
2.2 ~
-40 ~ 85
-40 ~ 125
Unit
V
V
V
µF
µF
°C
°C
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Oct., 2008
2
www.anpec.com.tw

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