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MAX9947 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - AISG Integrated Transceiver - Maxim Integrated Products

भाग संख्या MAX9947
समारोह AISG Integrated Transceiver
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
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<?=MAX9947?> डेटा पत्रक पीडीएफ

MAX9947 pdf
MAX9947
AISG Integrated Transceiver
Absolute Maximum Ratings
VCC to GND.............................................................-0.3V to +6V
VL to GND................................................................-0.3V to +6V
TXOUT, BIAS to GND............................... -0.3V to (VCC + 0.3V)
RXIN, XTAL1, XTAL2, SYNCOUT, RES to GND.....-0.3V to +6V
TXIN, RXOUT, DIR, DIRMD1,
DIRMD2 to GND....................................... -0.3V to (VL + 0.3V)
Output Short-Circuit Current TXOUT,
SYNCOUT to VCC or GND.....................................Continuous
All Other Pins Max In/Out Current.................................... ±20mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TQFN (derate 17.5mW/°C).............................1399mW
Operating Temperature Range.......................... -40°C to +105°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θJA)........57.2°C/W
Junction-to-Case Thermal Resistance (θJC)................40°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VCC = 5V, VL = 3.3V, TXOUT connected with 50Ω to RXIN, 4.1kΩ resistor between BIAS and RES, 10kΩ resistor between RES and
GND, 1kΩ resistor between SYNCOUT and VCC, TA = TMIN to TMAX, unless otherwise specified. XTAL frequency 8.704MHz ±30ppm.
Typical values are at TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITION
DC CHARACTERISTICS
Supply Voltage
VCC
Guaranteed by PSRR
Supply Current
ICC
TA ≤ 85°C
TA > 85°C
Logic Supply Voltage
Logic Supply Current
Receiver Power-Supply
Rejection Ratio
VL
IL
PSRR
Guaranteed by logic supply current
VTXIN = 3.3V
3.0V ≤ VCC ≤ 5.5V, VTXIN = 3.3V
(Note 3)
Output Power-Supply
Rejection Ratio
3.0V ≤ VCC ≤ 5.5V, VTXIN = 0V
(Note 4)
LOGIC INPUTS AND OUTPUTS
Logic-Input High Threshold
Voltage
VIH DIRMD1, DIRMD2, TXIN
Logic-Input Low Threshold
Voltage
VIL DIRMD1, DIRMD2, TXIN
Logic-Output High Threshold
Voltage
VOH
RXOUT, DIR source 3.3mA
Logic-Output Low Threshold
Voltage
VOL RXOUT, DIR sink 3.3mA
TXIN shorted to GND or VL
Input Leakage Current
IIH, IIL
DIRMD1, DIRMD2
Shorted to GND
Shorted to VL
SYNC INPUT (XTAL1) AND OUTPUT (SYNCOUT)
Input High Threshold Voltage
VXTAL1_IH
MIN TYP MAX UNITS
3.0 5.5
23 35
27 40
1.6 5.5
138 380
49 60
49 60
V
mA
V
µA
dB
dB
0.7 x VL
0.9 x VL
-1
0.7 x
VCC
0.3 x VL
0.1 x VL
±1
+60
V
V
V
V
µA
V
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