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MAX9919 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Current-Sense Amplifiers - Maxim Integrated Products

भाग संख्या MAX9919
समारोह Current-Sense Amplifiers
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX9919?> डेटा पत्रक पीडीएफ

MAX9919 pdf
MAX9918/MAX9919/MAX9920
-20V to +75V Input Range,
Precision Uni-/Bidirectional,
Current-Sense Amplifiers
Absolute Maximum Ratings
VCC to GND.............................................................-0.3V to +6V
RS+, RS- to GND (VCC = 5V).................................-30V to +80V
RS+, RS- to GND (VCC = 0V)............-15V to +80V (15 minutes)
Differential Input Voltage (VRS+ - VRS-)
(MAX9918/MAX9919)................................. ±15V (Continuous)
Differential Input Voltage
(VRS+ - VRS-) (MAX9920)............................ ±5V (Continuous)
REFIN, FB, OUT to GND.......................... -0.3V to (VCC + 0.3V)
SHDN to GND........................................................-0.3V to +20V
**As per JEDEC51 Standard (multilayer board).
Output Short Circuit to VCC or GND..........................Continuous
Continuous Current into Any Pin
(Not to exceed package power dissipation)..................±20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin SO-EP (derate 24.4mW/°C above +70°C)... 1951.2mW**
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................ +260°C
Package Thermal Characteristics (Note 1)
SO-EP
Junction-to-Ambient Thermal Resistance (θJA)...........41°C/W
Junction-to-Case Thermal Resistance (θJC)..................7°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
8 SO-EP
PACKAGE CODE
S8E+14
Outline Number
21-0111
Land Pattern Number
90-0151
Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA)
Junction to Case (θJC)
Thermal Resistance, Four-Layer Board:
52°C/W
6°C/W
Junction to Ambient (θJA)
Junction to Case (θJC)
41°C/W
7°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated 2

विन्यास 19 पेज
डाउनलोड[ MAX9919 Datasheet.PDF ]


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