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MAX9944 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - (MAX9943 / MAX9944) Low-Power Op Amps - Maxim Integrated Products

भाग संख्या MAX9944
समारोह (MAX9943 / MAX9944) Low-Power Op Amps
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX9944?> डेटा पत्रक पीडीएफ

MAX9944 pdf
MAX9943/MAX9944
High-Voltage, Precision, Low-Power Op Amps
Absolute Maximum Ratings
Supply Voltage (VCC to VEE).................................-0.3V to +40V
All Other Pins (Note 1)................... (VEE - 0.3V) to (VCC + 0.3V)
OUT Short-Circuit Current Duration
8-Pin μMAX (VCC - VEE ≤ 20V)........................................... 3s
8-Pin μMAX (VCC - VEE > 20V)............................. Momentary
6-Pin TDFN (VCC - VEE ≤ 20V)......................................... .60s
6-Pin TDFN (VCC - VEE > 20V)........................................... 2s
8-Pin SO (VCC - VEE ≤ 20V).............................................. 60s
8-Pin SO (VCC - VEE > 20V)................................................ 2s
8-Pin TDFN (VCC - VEE ≤ 20V).......................................... 60s
8-Pin TDFN (VCC - VEE > 20V)........................................... 2s
Note 1: Operation is limited by thermal limits.
Continuous Input Current (Any Pins)................................±20mA
Thermal Limits (Note 2)
Multiple Layer PCB
Continuous Power Dissipation (TA = +70°C)
8-Pin μMAX (derate 4.8mW/°C above +70°C)..........387.8mW
6-Pin TDFN-EP (derate 23.8mW/°C above +70°C).... 1904.8mW
8-Pin SO (derate 7.6mW/°C above +70°C)..................606.1W
8-Pin TDFN-EP (derate 24.4mW/°C above +70°C).... 1951.2mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 2)
8 μMAX
Junction-to-Ambient Thermal Resistance (θJA)......206.3°C/W
Junction-to-Ambient Case Resistance (θJC)................42°C/W
6 TDFN-EP
Junction-to-Ambient Thermal Resistance (θJA)...........42°C/W
Junction-to-Ambient Case Resistance (θJC)..................9°C/W
8 SO
Junction-to-Ambient Thermal Resistance (θJA).........132°C/W
Junction-to-Ambient Case Resistance (θJC)................38°C/W
8 TDFN-EP
Junction-to-Ambient Thermal Resistance (θJA)...........41°C/W
Junction-to-Ambient Case Resistance (θJC)..................8°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VCC = 15V, VEE = -15V, VCM = 0V, RL = 10kΩ to GND, VGND = 0V, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless
otherwise noted.) (Note 3)
PARAMETER
DC CHARACTERISTICS
Operating Supply Voltage Range
Quiescent Supply Current per
Amplifier
Power-Supply Rejection Ratio
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current
Input Offset Current
Input Voltage Range
Common-Mode Rejection Ratio
SYMBOL
CONDITIONS
VSUPPLY
ICC
PSRR
VOS
TCVOS
IBIAS
IOS
VIN+ , VIN-
CMRR
Guaranteed by PSRR test
VS = ±3V to ±19V
TA = +25°C
TA = -40°C to +125°C
VEE + 0.3V ≤ VCM ≤ VCC - 1.8V
VEE ≤ VCM ≤ VCC - 1.8V
VEE ≤ VCM ≤ VCC - 1.8V
Guaranteed by CMRR test,
TA = -40°C to +125°C
VEE + 0.3V ≤ VCM ≤ VCC - 1.8V
VEE ≤ VCM ≤ VCC - 1.8V
MIN TYP MAX UNITS
±3 ±19 V
550 950
µA
105 130
dB
20 100
µV
240
0.4 µV/°C
4 20
nA
90
1 10 nA
VEE
VCC -
1.8
V
105 125
105
dB
www.maximintegrated.com
Maxim Integrated │2

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