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MAX3485 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - True RS-485/RS-422 Transceivers - Maxim

भाग संख्या MAX3485
समारोह True RS-485/RS-422 Transceivers
मैन्युफैक्चरर्स Maxim 
लोगो Maxim लोगो 
पूर्व दर्शन
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<?=MAX3485?> डेटा पत्रक पीडीएफ

MAX3485 pdf
MAX3483/MAX3485/
MAX3486/MAX3488/
MAX3490/MAX3491
3.3V-Powered, 10Mbps and Slew-Rate-Limited
True RS-485/RS-422 Transceivers
Absolute Maximum Ratings
Supply Voltage (VCC)..............................................................7V
Control Input Voltage (RE, DE)..................................-0.3V to 7V
Driver Input Voltage (DI).............................................-0.3V to 7V
Driver Output Voltage (A, B, Y, Z).........................-7.5V to 12.5V
Receiver Input Voltage (A, B)................................-7.5V to 12.5V
Receiver Output Voltage (RO).................. -0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)...727mW
8-Pin SO (derate 5.88mW/°C above +70°C)................471mW
14-Pin Plastic DIP (derate 10mW/°C above +70°C)....800mW
14-Pin SO (derate 8.33mW/°C above +70°C)..............667mW
Operating Temperature Ranges
MAX34_ _C_ _....................................................0°C to +70°C
MAX34_ _E_ _................................................ -40°C to +85°C
Junction Temperature.......................................................+160°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
Package Information
14 SOIC
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA)
Junction to Case (θJA)
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA)
Junction to Case (θJA)
21-0041
90-0112
120
37
84
34
S14+1
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated 2

विन्यास 17 पेज
डाउनलोड[ MAX3485 Datasheet.PDF ]


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