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MAX3523 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Low-Power DOCSIS 3.1 Programmable-Gain Amplifier - Maxim Integrated

भाग संख्या MAX3523
समारोह Low-Power DOCSIS 3.1 Programmable-Gain Amplifier
मैन्युफैक्चरर्स Maxim Integrated 
लोगो Maxim Integrated लोगो 
पूर्व दर्शन
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<?=MAX3523?> डेटा पत्रक पीडीएफ

MAX3523 pdf
MAX3523
Low-Power DOCSIS 3.1
Programmable-Gain Amplifier
Absolute Maximum Ratings
VDD to GND..........................................................-0.3V to +6.0V
TXEN, SDA, SCLK, CSB......................................-0.3V to +6.0V
IN+, IN-..............................................................VDD - 2.1V to 6V
OUT+, OUT- to GND.......................................-0.3V to VDD + 5V
RF Input Power...............................................................+10dBm
Continuous Power Dissipation (TA = 70°C)
(derate 54mW/°C above TA = 70°C)..........................3500mW
Operating Junction Temperature (Note 4)......... -40°C to +150°C
Storage Temperature Range............................. -65°C to +165°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
20 TQFN-EP
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA)
Junction to Case (θJC)
21-0140
90-0010
T2055+5
PCB must be designed for a θJA of 18.5°C/W or lower
2°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated 2

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डाउनलोड[ MAX3523 Datasheet.PDF ]


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