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IDTP9020 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - WPC Compliant Wireless Power Receiver IC - IDT

भाग संख्या IDTP9020
समारोह WPC Compliant Wireless Power Receiver IC
मैन्युफैक्चरर्स IDT 
लोगो IDT लोगो 
पूर्व दर्शन
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<?=IDTP9020?> डेटा पत्रक पीडीएफ

IDTP9020 pdf
IDTP9020
Preliminary Datasheet
ABSOLUTE MAXIMUM RATINGS
These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage
to the device. Functional operation of the IDTP9020 at absolute maximum ratings is not implied. Application of the absolute maximum rating conditions
affects device reliability.
Table 1. Absolute Maximum Ratings Summary. All voltages are referred to ground, unless otherwise noted.
PINS
MAXIMUM
RATING
UNITS
INP, INM
-1 to 24
V
REG_IN, E¯N¯, BUCK5VR_IN, REC_OUT, LX, ZREFP,ZREFM, ACMP, ACMM
-0.3 to 24
V
BST
-0.3 to
BUCK5VR_IN+5
V
LDO2P5V, XTAL/CLK_IN, XTAL/CLK_OUT
-0.3 to 2.75
V
AGND, DGND, PGND, REFGND
-0.3 to +0.3
V
All Other Pins
-0.3 to 6.0
V
Maximum Current from REC_OUT
1.5 A
Maximum Current from INP, INM
1 ARMS
Maximum Current from LX
2A
Table 2. Package Thermal Information
SYMBOL DESCRIPTION
ΘJA Thermal Resistance Junction to Ambient
MAXIMUM
RATING
NTG56-TQFN
28.5
MAXIMUM
RATING
WLCSP-99
37 THERMAL VIAS
33.4
MAXIMUM
RATING
WLCSP-99
0 THERMAL VIAS
52.7
UNITS
C/W
ΘJC Thermal Resistance Junction to Case
11.2 0.28
0.28 C/W
ΘJB2 Thermal Resistance Junction to Board
0.56
C/W
TJ Junction Temperature
0 to +150
0 to +150
0 to +150
C
TA Ambient Operating Temperature
0 to +85
0 to +85
0 to +85
C
TSTG Storage Temperature
-55 to +150
-55 to +150
-55 to +150
C
TLEAD Lead Temperature (soldering, 10s)
+300 +300
+300 C
Note 1: The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
Note 2: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions. Actual thermal resistance is affected by
PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. For the NTG56 package, connecting the 5.7mm X 5.7mm EP to
internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall
thermal performance.
Revision 0.2
2 © 2013 Integrated Device Technology, Inc.

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