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P9025AC डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Qi Wireless Power Receiver - IDT

भाग संख्या P9025AC
समारोह Qi Wireless Power Receiver
मैन्युफैक्चरर्स IDT 
लोगो IDT लोगो 
पूर्व दर्शन
1 Page
		
<?=P9025AC?> डेटा पत्रक पीडीएफ

P9025AC pdf
P9025AC DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings,
which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
Table 1: Absolute Maximum Ratings Summary
Pins
AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_
BST1, BST2 to PGND1
INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND
PGND, PGND1, PGND2, to AGND
Out Current
AC1, AC2 Current
Rating
-0.3 to 20
-0.3 to (AC1, AC2 + 6)
-0.3 to 6
-0.3 to 0.3
1.5
2
Table 2: Package Thermal Information1,2,3,4
Units
V
V
V
V
A
ARMS
Symbol
ΘJA
ΘJC
ΘJB
TJ
TA
TSTG
TLEAD
Description
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Thermal Resistance Junction to Board
Operating Junction Temperature
Ambient Operating Temperature
Storage Temperature
Lead Temperature (soldering, 10s)
Rating (VFQFPN)
35
29.6
2.4
0 to +125
0 to +85
-55 to +150
300
Units
C/W
C/W
C/W
C
C
C
C
NOTES:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of
the PCB, is recommended for improving the overall thermal performance.
Table 3: ESD Information
Test Model
HBM
CDM
Pins
All pins
All pins
Ratings
±1500
±500
Units
V
V
5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT
2 09/01/15

विन्यास 20 पेज
डाउनलोड[ P9025AC Datasheet.PDF ]


शेयर लिंक


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