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P9038 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Wireless Power Transmitter - IDT

भाग संख्या P9038
समारोह Wireless Power Transmitter
मैन्युफैक्चरर्स IDT 
लोगो IDT लोगो 
पूर्व दर्शन
1 Page
		
<?=P9038?> डेटा पत्रक पीडीएफ

P9038 pdf
P9038 DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9038. These ratings, which
are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any
other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
Table 1: Absolute Maximum Ratings Summary. (All voltages are referred to ground.)
Pins
VBUS_SNS
EN, IN, REG_IN, SW1, SW2, ISNSN_IN, ISNSP_IN
GPIO_6:0, SCL, SDA, RESET, DP, DM, NC, NC1, NC2, NC3, SHIELD2, LDO5V, LDO2P5V_IN,
INV5V_IN, VFOD_SNS, ISNS, HPF, OVP_SEL, ISNS_V
BST1, BST2
GATE
GND, REFGND, PGND1, PGND2
SHIELD1
LDO2P5V
Table 2: Package Thermal Information1,2,3
Rating
-0.3 to 27
-0.3 to 12.5
-0.3 to 5.5
-0.3 to SW+6
-0.3 to REG_IN+6
+0.3
-0.3 to 8
-0.3 to 2.75
Units
V
V
V
V
V
V
V
V
Symbol
ΘJA
ΘJC
ΘJB
TJ
TA
TSTG
TLEAD
Description
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Thermal Resistance Junction to Board
Operating Junction Temperature
Ambient Operating Temperature
Storage Temperature
Lead Temperature (soldering, 10s)
Rating (VFQFPN)
25.5
8.6
2.4
-40 to +125
-40 to +85
-55 to +150
+300
Units
C/W
C/W
C/W
C
C
C
C
NOTES:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature,
and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
Table 3: ESD Information
Test Model
HBM
CDM
Pins
All pins
All pins
Ratings
±2000
±500
Units
V
V
©2016 Integrated Device Technology, Inc.
2
P9038 August 1, 2016

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डाउनलोड[ P9038 Datasheet.PDF ]


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