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HIP2100 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - High Frequency Half Bridge Driver - Renesas

भाग संख्या HIP2100
समारोह High Frequency Half Bridge Driver
मैन्युफैक्चरर्स Renesas 
लोगो Renesas लोगो 
पूर्व दर्शन
1 Page
		
<?=HIP2100?> डेटा पत्रक पीडीएफ

HIP2100 pdf
HIP2100
Ordering Information
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(Units) (Note 1)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
HIP2100IBZ
2100 IBZ
-40 to +125
- 8 Ld SOIC
M8.15
HIP2100IBZT
2100 IBZ
-40 to +125
2.5k 8 Ld SOIC
M8.15
HIP2100EIBZ
2100 EIBZ
-40 to +125
- 8 Ld EPSOIC
M8.15C
HIP2100EIBZT
2100 EIBZ
-40 to +125
2.5k 8 Ld EPSOIC
M8.15C
HIP2100IRZ
HIP 2100IRZ
-40 to +125
- 16 Ld 5x5 QFN L16.5x5
HIP2100IRZT
HIP 2100IRZ
-40 to +125
6k 16 Ld 5x5 QFN
L16.5x5
HIP2100EVAL2
Evaluation Board
NOTES:
1. See TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020.
3. For Moisture Sensitivity Level (MSL), see the HIP2100 device page. For more information about MSL, see TB363.
Pinouts
(8 LD SOIC, EPSOIC)
TOP VIEW
VDD 1
HB 2
HO 3
HS 4
EPAD
8 LO
7 VSS
6 LI
5 HI
EPAD = Exposed PAD.
(16 LD QFN)
TOP VIEW
16 15 14 13
NC 1
HB 2
HO 3
NC 4
EPAD
12 NC
11 VSS
10 LI
9 NC
5678
Pin Descriptions
SYMBOL
VDD
HB
HO
HS
HI
LI
VSS
LO
EPAD
DESCRIPTION
Positive Supply to lower gate drivers. De-couple this pin to VSS. Bootstrap diode connected to HB.
High-Side Bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.
Bootstrap diode is on-chip.
High-Side Output. Connect to gate of High-Side power MOSFET.
High-Side Source connection. Connect to source of High-Side power MOSFET. Connect negative side of bootstrap capacitor to
this pin.
High-Side input.
Low-Side input.
Chip negative supply, generally will be ground.
Low-Side Output. Connect to gate of Low-Side power MOSFET.
Exposed Pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.
FN4022 Rev.16.00
Aug 8, 2019
Page 2 of 14

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