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HMC-AUH312 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Low Noise Wideband Amplifier - Analog Devices

भाग संख्या HMC-AUH312
समारोह Low Noise Wideband Amplifier
मैन्युफैक्चरर्स Analog Devices 
लोगो Analog Devices लोगो 
पूर्व दर्शन
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HMC-AUH312 pdf
HMC-AUH312
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
0.5 GHz to 60 GHz Frequency Range........................................ 3
60 GHz to 80 GHz Frequency Range......................................... 3
Recommended Operating Conditions ...................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Interface Schematics..................................................................... 7
Typical Performance Characteristics ............................................. 8
REVISION HISTORY
11/15—v04.0615 to Rev. E
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Updated Format..................................................................Universal
Changes to Title of Data Sheet............................................... Page 1
Change Vg1 to VGG1, Vg2 to VGG2, Vd to VDD, RFIN to
RFIN/VGG1, and RFOUT to RFOUT/VDD.................. Throughout
Changes to General Description Section ...................................... 1
Changes to Gain Parameter, Table 2 .............................................. 3
Changes to Power Dissipation Parameter and Operating
Temperature Parameter, Table 3 ..................................................... 3
Changes to Power Dissipation Parameter and Operating
Temperature Parameter, Table 4 ..................................................... 4
Changes to Table 5............................................................................ 5
Added Figure 2, Renumbered Sequentially .................................. 6
Changes to Table 6............................................................................ 6
Data Sheet
Theory of Operation ...................................................................... 11
Applications Information .............................................................. 12
Applications Overview .............................................................. 12
Device Mounting........................................................................ 14
Device Operation ....................................................................... 14
Mounting and Bonding Techniques for Millimeterwave GaAs
MMICs............................................................................................. 15
Handling Guidelines for ESD Protection of GaAs MMICs.. 15
Handling Precautions ................................................................ 15
Mounting Techniques ................................................................ 16
Wire Bonding.............................................................................. 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 17
Added Interface Schematics Section...............................................7
Changes to Figure 3...........................................................................7
Changes to Figure 14, Figure 16, and Figure 19............................9
Changes to Figure 20...................................................................... 10
Added Theory of Operation Section and Figure 21 .................. 11
Added Applications Information Section and Applications
Overview Section............................................................................ 12
Changes to Figure 24 and Figure 25 ............................................ 13
Changes to Device Power-Up Instructions Section and Device
Power-Down Instructions Section............................................... 14
Added Handling Guidelines for ESD Protection of GaAs MMICs
Section and Opening the Protective Packaging Section ................ 15
Changes to Handling Precautions Section.................................. 15
Changes to Mounting Techniques Section ................................. 16
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide .......................................................... 17
Rev. E | Page 2 of 17

विन्यास 17 पेज
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