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APW7311 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Synchronous Buck Regulator - ANPEC

भाग संख्या APW7311
समारोह Synchronous Buck Regulator
मैन्युफैक्चरर्स ANPEC 
लोगो ANPEC लोगो 
पूर्व दर्शन
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<?=APW7311?> डेटा पत्रक पीडीएफ

APW7311 pdf
APW7311
Ordering and Marking Information
APW7311
APW7311 KA :
APW7311
XXXXX
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN Supply Voltage (VIN to GND)
VLX LX to GND Voltage
EN, FB, COMP, SS to GND Voltage
-0.3 ~ 30
-1 ~VIN+0.3
-0.3 ~ 6
V
V
V
VBS
PD
TJ
TSTG
TSDR
BS to GND Voltage
Power Dissipation
Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
VLX-0.3 ~ VLX+6
Internally Limited
150
-65 ~ 150
260
V
W
oC
oC
oC
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
Junction-to-Case Resistance in Free Air (Note 3)
SOP-8P
SOP-8P
Typical Value
75
15
Unit
oC/W
oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8P package.
Copyright © ANPEC Electronics Corp.
Rev. P.1 - Jan., 2013
2
www.anpec.com.tw

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